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Invention candidates relevant to Absolics (SKC)

First-mover glass-substrate commercialization

Absolics, the SKC subsidiary, is the first mover commercializing glass substrates at scale — backed by CHIPS and NAPMP funding and sampling to AMD from its Covington, Georgia fab. As the company actually shipping glass-core, it is the best co-development and license target for the liner, barrier, and dielectric chemistries that ride on top of the glass.

Why nowAbsolics is already sampling glass-core substrates to AMD from Covington with roughly $175 million in federal funding behind it — the CHIPS Act award and NAPMP support together — the liner, barrier, and RDL dielectric decisions that will define the production stack are being made right now, and locking in validated, preliminary-IP-screened chemistry before those process nodes are committed is a closing window, not a future option.

What Lattice Graph could do for Absolics (SKC)

Lattice Graph is a computational materials-discovery platform built around a knowledge graph spanning millions of compositions. Priority candidate materials must earn consensus validation across multiple independent machine-learning interatomic potentials — drawn from MACE, CHGNet, MatterSim, and ORB — before advancing, and phonon and thermodynamic stability are required checkpoints, not optional filters. Materials that clear that bar proceed to targeted density-functional-theory simulations and, ultimately, to deposition-ready specifications. Beyond candidate generation, Lattice Graph carries a large, curated atlas of labeled negative results — failed synthesis attempts and disqualified compositions — so the search space collapses before a single wafer is touched. Freedom-to-operate and patent-whitespace screening across our indexed corpus of materials patents is embedded in the same platform, meaning IP risk is assessed at the composition level, not as an afterthought once a formulation is already in the process roadmap. The result is a full-stack discovery engine: from composition hypothesis, through multi-potential validation and DFT refinement, to intellectual-property clarity — all before pilot deposition.

Why these invention candidates are relevant to Absolics (SKC)

Absolics occupies a singular position in the advanced-packaging supply chain: as the SKC subsidiary that is already manufacturing glass-core substrates at its Covington, Georgia fab and sampling to AMD, it is the one company in the ecosystem that needs chemistry stack solutions now, not at some future inflection point. The approximately $75 million in CHIPS Act funding and approximately $100 million in NAPMP support mean Absolics has the capital and the government mandate to move quickly — and the pressure to arrive at production chemistry with clean intellectual-property standing, because every layer above the glass will be scrutinized by customers, partners, and regulators alike. Lattice Graph maps directly to that commercial reality. The platform's Glass-core advanced-packaging substrates portfolio was built around precisely the liner, barrier, and redistribution-layer dielectric chemistries that Absolics needs to license or co-develop to complete its stack. Rather than directing Absolics toward a portfolio of speculative compositions, we can offer computational candidates that passed multi-potential stability screening, a preliminary patent screen of the relevant landscape (not a freedom-to-operate opinion), and process sequences designed for ALD/CVD deposition — a starting point for Absolics' process integration team, with deposition, measurement and qualification still to be done. The co-development and licensing fit is structural, not coincidental. Absolics ships the glass; Lattice Graph's candidate assets are aimed at what goes on top of it. That combination — first-mover substrate platform plus a computationally screened, preliminary-IP-screened candidate chemistry stack — is, in our view, a proposition hyperscaler and accelerator customers may look for as the industry scales. An engagement now positions both organizations to present a unified, deposition-ready glass-core package to the market before competing organic-substrate incumbents can answer.

Absolics (SKC) business lines

  • →Glass-substrate manufacturing (Covington, GA)
  • →Through-glass-via & RDL integration
  • →CHIPS / NAPMP-backed scale-up
  • →Hyperscaler & accelerator substrate supply

Where we fit

Absolics is already shipping glass — what it needs is the chemistry stack on top: an AlN via liner that turns the via into a heat path, a thin copper-diffusion barrier, and a sub-2-micron RDL dielectric ladder. This is a co-development and license fit, not just an acquisition target, with the IP arriving deposition-ready (preliminary IP screen only, not a freedom-to-operate opinion).

Why nowAbsolics is already sampling glass-core substrates to AMD from Covington with roughly $175 million in federal funding behind it — the CHIPS Act award and NAPMP support together — the liner, barrier, and RDL dielectric decisions that will define the production stack are being made right now, and locking in validated, preliminary-IP-screened chemistry before those process nodes are committed is a closing window, not a future option.

The Lattice Graph fit for Absolics (SKC)

Absolics occupies a singular position in the advanced-packaging supply chain: as the SKC subsidiary that is already manufacturing glass-core substrates at its Covington, Georgia fab and sampling to AMD, it is the one company in the ecosystem that needs chemistry stack solutions now, not at some future inflection point. The approximately $75 million in CHIPS Act funding and approximately $100 million in NAPMP support mean Absolics has the capital and the government mandate to move quickly — and the pressure to arrive at production chemistry with clean intellectual-property standing, because every layer above the glass will be scrutinized by customers, partners, and regulators alike. Lattice Graph maps directly to that commercial reality. The platform's Glass-core advanced-packaging substrates portfolio was built around precisely the liner, barrier, and redistribution-layer dielectric chemistries that Absolics needs to license or co-develop to complete its stack. Rather than directing Absolics toward a portfolio of speculative compositions, we can offer computational candidates that passed multi-potential stability screening, a preliminary patent screen of the relevant landscape (not a freedom-to-operate opinion), and process sequences designed for ALD/CVD deposition — a starting point for Absolics' process integration team, with deposition, measurement and qualification still to be done. The co-development and licensing fit is structural, not coincidental. Absolics ships the glass; Lattice Graph's candidate assets are aimed at what goes on top of it. That combination — first-mover substrate platform plus a computationally screened, preliminary-IP-screened candidate chemistry stack — is, in our view, a proposition hyperscaler and accelerator customers may look for as the industry scales. An engagement now positions both organizations to present a unified, deposition-ready glass-core package to the market before competing organic-substrate incumbents can answer.

Portfolio fit for Absolics (SKC)

The Glass-core advanced-packaging substrates portfolio is the primary fit. It contains the through-glass-via liner, copper diffusion barrier, redistribution-layer dielectric, and integrated stack claims that map one-for-one to Absolics' process integration roadmap. The aluminum nitride thermal liner converts a via wall from a thermal resistance into an active heat path — a direct answer to the thermal management challenge that arises as Absolics scales to high-power accelerator packages for customers like AMD. The tungsten boride copper diffusion barrier is proposed, from a computed Cu migration barrier, to block copper at sub-TaN thickness, which would preserve via geometric budget in the high-aspect-ratio through-glass vias that Absolics' glass platform enables. The ordered fabrication method claims cover the full deposition sequence and are structured to be licensed as a manufacturing process, not just as materials claims. The Integrated packaging, storage and PFAS-treatment systems portfolio adds two additional layers of value. Its bandgap-graded borate and oxynitride multilayer dielectric stack is designed to reduce carrier injection, as an input toward sub-2-micron redistribution-layer pitch — the fine-pitch RDL that can differentiate glass-core from conventional organic laminate at the electrical level. The barium hafnate Ruddlesden-Popper high-permittivity dielectric offers a path to integrating high-density MIM capacitors directly into the package, a capability hyperscaler customers are increasingly demanding for on-package power delivery. Both assets carry a preliminary FTO screen across the screened patent landscape. The High-power thermal-interface materials portfolio rounds out the picture at the assembled-package level. As Absolics' glass substrate moves from sampling to volume supply, the thermal interface between the package and the heat spreader becomes a co-optimization problem — and materials in this portfolio have been validated against the same multi-potential thermodynamic framework as the via and dielectric chemistries, ensuring compatibility across the full stack.

Discoveries we'd license to Absolics (SKC)

See the full portfolio →

Selected from our discovery portfolio and weighted to Absolics (SKC)'s programs — each with a computational evidence dossier. Open any for the full technical read.

Under reviewChecked by 2 ML potentials

Aluminum nitride thermal liner for through-glass vias in advanced packaging

Wurtzite AlN via-wall liner proposed as a heat path through a glass-core via. A one-dimensional series-resistance model projects lower through-via thermal resistance; the effect has not been measured.

Preliminary screen onlyAlN
semiconductor packagingDetails →
★ FlagshipChecked by 2 ML potentials

Integrated glass-core advanced-packaging substrate stack

Single ordered glass-core article spanning thermal liner, Cu barrier, dielectric, cap and passive layers, with 16 package-reliability endpoints defined for qualification (not yet run).

Preliminary screen only
semiconductor packagingDetails →
★ FlagshipChecked by 2 ML potentials

Tungsten boride copper diffusion barrier on alumina-borate liner for glass-core vias

Tungsten boride copper barrier on an alumina-borate adhesion liner, with a computed copper migration barrier of about 3 eV, proposed to block copper diffusion at thinner films than TaN in high-aspect-ratio through-glass vias.

Preliminary screen onlyB2W / WBx (x~1.5-2.5)
semiconductor packagingDetails →
★ FlagshipChecked by 3 ML potentials

Glass-core packaging stack with aluminum borate liner, tungsten boride barrier, and chlorine-retaining RDL dielectric

Integrated glass-core substrate stack combining a conformal AlBO3 liner, a crystalline WB2 copper diffusion barrier, and a retained-chlorine amorphous dielectric for advanced semiconductor packaging.

Defined carve-outAlBO3 / WB2 / AlOxCly
semiconductor packagingDetails →
StrongSimulation-screened

Ordered fabrication method for integrated glass-core advanced-packaging substrates

A process claim covering the ordered deposition sequence — thermal liner, Cu barrier, gradient sublayer, copper fill, cap, dielectric, and high-k passive — for manufacturing the integrated glass-core package stack.

Preliminary screen only
semiconductor packaging fabDetails →
★ FlagshipChecked by 2 ML potentials

Barium hafnate Ruddlesden-Popper high-permittivity dielectric for MIM capacitors

Layered Ba2HfO4 with a database-computed permittivity of ~53.5, proposed for high-density MIM capacitors in DRAM and advanced packaging.

Blocking patents listedBa2HfO4
semiconductor memoryDetails →

Why these fit Absolics (SKC)

Aluminum nitride thermal liner for through-glass vias in advanced packaging →

As Absolics scales to supply accelerator packages for customers like AMD, the through-glass via becomes a thermal bottleneck that limits package power density. The wurtzite AlN liner is designed to turn that via wall into a heat path; a simple series-resistance model projects through-via thermal resistance falling by 50% or more (not yet measured), which would support high-power glass-core packaging. The composition carries a preliminary FTO screen and is specified for ALD deposition, making it compatible with Absolics' existing process infrastructure.

Tungsten boride copper diffusion barrier on alumina-borate liner for glass-core vias →

High-aspect-ratio through-glass vias — one of the defining advantages of Absolics' glass platform over organic laminates — impose a severe geometric constraint on barrier films: every nanometer consumed by the barrier is a nanometer lost from the copper conductor. The refractory tungsten boride barrier is proposed, from a computed Cu migration barrier, to block copper diffusion at sub-TaN thickness, which would preserve more of Absolics' via geometry; it has not been tested against the copper-reliability requirements AMD and other hyperscaler customers impose. The alumina-borate adhesion liner underneath provides the conformality needed on glass via walls.

Bandgap-graded borate and oxynitride multilayer dielectric stack for sub-2-micron packaging →

Fine-pitch redistribution layers below 2 microns are what separates a glass-core substrate from a commodity laminate in the eyes of compute-chip customers. This bandgap-graded dielectric ladder is designed to reduce carrier injection at each conductor interface, as an input to the sub-2-micron RDL pitch Absolics targets at the leading edge; leakage at fine pitch has not been measured. The asset carries a preliminary FTO screen and is the dielectric counterpart to the via liner and barrier claims, meaning it completes the chemistry stack above the glass rather than requiring Absolics to source a dielectric independently.

Integrated glass-core advanced-packaging substrate stack →

A single ordered-stack claim spanning thermal liner, copper barrier, dielectric, cap, and passive layers — with 16 package reliability endpoints defined, not yet run — gives Absolics a licensable system-level IP position, not just a collection of individual material claims. For the CHIPS Act and NAPMP reporting obligations that accompany Absolics' roughly $175 million in combined CHIPS Act and NAPMP funding, arriving at customer qualification with a stack that is both teardown-verifiable and preliminary-IP-screened under a single license is a significant program-management advantage.

The challenge

Name a computational feat you think we can't do.

Absolics must qualify a copper diffusion barrier inside a high-aspect-ratio through-glass via where every nanometer of barrier film directly reduces the copper conductor cross-section and increases via resistance — yet the barrier must block copper migration at 400 C anneal conditions to satisfy package reliability requirements for AMD-class accelerator loads. Standard TaN solutions consume too much geometric budget at the aspect ratios Absolics' glass platform enables, and no commercially available alternative has been validated for thermodynamic stability on a glass via wall at those temperatures. Lattice Graph's multi-potential screening and the tungsten boride barrier asset are aimed at this constraint, with a composition checked for computed bulk phonon stability by ML potentials and a preliminary FTO screen in the relevant patent space; thin-film copper diffusion is untested.

Send us a challenge →

APIs & data for Absolics (SKC)

Live data and API products running on our production platform — licensed to your team, with full schemas and access terms on request.

The Knowledge-Graph API gives Absolics' materials and process integration engineers direct programmatic access to provenance-tracked composition data, evidence neighborhoods, and natural-language graph queries across Lattice Graph's full composition space. For a company at Absolics' stage — moving from sampling to volume qualification — the practical value is speed: an engineer can query the graph for all compositions that have cleared multi-potential phonon stability within a target deposition-temperature window, or retrieve the full evidence chain behind a specific barrier candidate, without waiting for a research handoff. Composition-360 views aggregate synthesis routes, failure modes, and prior-art signals into a single retrievable record per material, so the team integrating barrier films at Covington works from the same validated dataset that generated the IP. The freedom-to-operate and patent-whitespace API operates at the composition and claim level across our indexed corpus of materials patents, which is the relevant scale for a company preparing to file and defend packaging-chemistry IP while simultaneously licensing from external sources. For Absolics, where CHIPS Act funding brings heightened scrutiny of the IP landscape and where co-development agreements with customers like AMD will require clear ownership boundaries, having composition-level preliminary patent screens available programmatically — to prioritise what counsel reviews, not to replace its legal opinions — can change both the pace and the cost of IP due diligence during process development.

FTO / Patent-Whitespace API

Composition- and claim-level prior-art and patent-whitespace screening across 306K materials patents: a preliminary technical screen for counsel, not a freedom-to-operate opinion.

Knowledge-Graph API

Provenance, composition-360, evidence neighborhoods, and natural-language graph queries across the materials knowledge graph.

In the platform for Absolics (SKC)

The Lattice Graph application gives Absolics' materials team a single workspace for every stage of stack development, from initial composition screening through qualification reporting. Multi-potential validation results — covering MACE, CHGNet, MatterSim, and ORB in parallel — are displayed side by side so engineers can immediately see where consensus holds and where models diverge, which is the signal that matters for de-risking a deposition decision. Phonon stability and thermodynamic stability assessments are integrated into the same view, not presented as separate analysis artifacts, so the team moves from hypothesis to a qualified candidate in one workflow rather than across disconnected tools. The negative-results atlas is surfaced directly in the application, meaning that when an engineer is evaluating a barrier or liner candidate, failed prior compositions in the same chemistry space are visible as context — with the specific failure modes labeled — rather than buried in literature or internal notebooks. A preliminary patent-screen flag (not a freedom-to-operate opinion) is rendered at the composition level alongside stability data, so the process integration team at Covington can see an early IP read on each candidate under consideration, for counsel to review. For Absolics' reporting obligations under its CHIPS and NAPMP agreements, the application's provenance tracking provides an auditable record of how each qualified composition was validated, which simplifies the technical documentation that federal program milestones require.

How an engagement works

A Lattice Graph engagement with Absolics begins with a targeted chemistry-stack audit: we map Absolics' current via liner, barrier, and RDL dielectric process targets against the topAssets in the Glass-core advanced-packaging substrates portfolio and the Integrated packaging, storage and PFAS-treatment systems portfolio, identify the closest validated compositions, and deliver freedom-to-operate assessments for each. This first phase is designed to run in parallel with Absolics' ongoing process integration work at Covington, so there is no delay to the sampling program already underway with AMD. Deliverables include ranked candidate specifications, deposition-parameter guidance derived from multi-potential validation, and a composition-level IP landscape report covering the most relevant patent families. From there, an engagement typically moves to a co-development structure or a direct license, depending on Absolics' preference for internal ownership versus speed to qualification. In a co-development arrangement, Lattice Graph provides ongoing platform access — including Knowledge-Graph API and freedom-to-operate API calls — as the Absolics team iterates on deposition conditions, with the platform's negative-results atlas actively informing which failure modes to anticipate at each integration step. Licensing is structured around the specific asset or stack claims that enter Absolics' process roadmap, with pricing calibrated to the addressable market size of the relevant portfolio rather than a flat platform fee. Both paths are designed to deliver a chemistry stack that arrives at AMD qualification with a clean intellectual-property chain — the outcome Absolics' commercial position and federal funding obligations both require.

Build the Absolics (SKC) package

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