Semiconductor packaging material selection
Semiconductor packaging requires balancing thermal, mechanical, electrical, and reliability constraints across multiple material layers. This guide covers the Lattice Graph approach to packaging material evaluation.
The packaging material challenge
Advanced packaging (chiplets, 2.5D/3D integration, fan-out wafer-level packaging) demands materials that meet tight thermal expansion matching, low dielectric loss, high thermal conductivity, and reliable adhesion. Each layer in the package stack constrains the others, so material selection must be done as a system rather than component by component.
CTE stack analysis
The Lattice Graph CTE solver models thermal expansion mismatch across a multi-layer packaging stack. Input your layer materials and thicknesses, and the solver calculates stress distributions at operating and reflow temperatures. It identifies which layer transitions contribute the most stress and suggests CTE-matched alternatives from the materials database.
Dielectric and thermal screening
Use materials search to filter candidates by dielectric constant (Dk), dissipation factor (Df), thermal conductivity, and glass transition temperature. Cross-source confidence scoring helps identify which dielectric property values are well-established versus uncertain. The package comparison tool lets you evaluate multiple candidate stacks side by side.
From selection to qualification
The packaging workflow exports a complete materials specification with property values, confidence scores, source citations, and CTE analysis results. This specification serves as the starting point for supplier qualification and reliability testing, with full traceability back to the data sources that informed the selection.
Ready to try it yourself?
Start exploring materials data with cross-source confidence, simulation workflows, and the tools described in this resource.