CuSn

CuSn is a metallic binary intermetallic compound that is theoretically stable and exhibits a wide variety of structural arrangements.

CuSn
Crystal structure of CuSn (hexagonal, P63mc (No. 186))
Ground-state structure · Materials Project
Overview

About CuSn

CuSn is a metallic intermetallic compound formed from copper and tin. It is characterized by its lack of a band gap, reflecting its conductive nature, and is considered a near-hull phase, suggesting it is a viable candidate for experimental synthesis and characterization.

With a high degree of structural complexity, this material is represented by numerous reported crystal structures across multiple databases. Its stability profile makes it a subject of interest for researchers investigating binary alloys and phase formation in metallic systems.

At a glance

Key Properties

Cross-validated computational properties for CuSn, aggregated across 5 databases.

Band Gap

Metallic / not reported

Energy Above Hull

0.000 eV/atom
Best (lowest) across sources

Stability

Stable
3 DFT sources

Structures

34
5 databases, 9 space groups
Validation

Cross-Source DFT Agreement

How well independent DFT databases agree on the thermodynamics of CuSn. Tight agreement means computed properties can be trusted without re-running calculations.

Agreement Score

0.96 / 1.00
Trust tier: high

Hull Spread

0.009 eV
EAH spread across sources

Sources Compared

3
jarvis, materials_project, oqmd

Space Group Consensus

All match
Crystallography

Reported Structures

Lowest-energy structures reported for CuSn, ranked by energy above hull.

Space GroupCrystal SystemBand Gap (eV)E above hull (eV/atom)E/atom (eV)Density (g/cm³)
P63/mmc (No. 194)hexagonal0.000.0000-0.022—
——0.000.0000-0.073—
P63/mmc (No. 194)hexagonal0.000.0092-17.7878.13
——0.000.16460.092—
——0.000.21930.147—
——0.000.22020.148—
——0.000.22670.154—
——0.000.24630.174—
——0.000.50260.430—
P63mc (No. 186)hexagonal———7.83
P63/mmc (No. 194)hexagonal———7.87
Pnma (No. 62)orthorhombic———7.54
Uses

Applications

Where CuSn is used.

Fundamental materials researchAlloy phase diagram studiesMetallic thin film development
Reference

Frequently Asked Questions

Common questions about CuSn, answered from cross-validated data.

What is CuSn?

CuSn is a metallic binary intermetallic compound that is theoretically stable and exhibits a wide variety of structural arrangements.

More questions
What is CuSn used for?
CuSn is used in fundamental materials research, alloy phase diagram studies, and metallic thin film development.
What is the band gap of CuSn?
The reported DFT structures of CuSn show no band gap. Standard DFT often misses gaps (especially in transition-metal oxides), so this is not proof the real material is a metal.
Is CuSn a metal, semiconductor, or insulator?
DFT calculations predict no band gap. Standard DFT can miss gaps, so measurements are needed to confirm metallic behavior.
Is CuSn thermodynamically stable?
Yes — CuSn sits on the convex hull (energy above hull 0 eV/atom), i.e. stable.
What is the crystal structure of CuSn?
The reference structure of CuSn is hexagonal symmetry, space group P63mc (No. 186).
What is the density of CuSn?
The computed density of the ground-state structure of CuSn is 7.83 g/cm³.
How many polymorphs of CuSn are known?
34 structures of CuSn are reported across 5 databases, spanning 9 distinct space groups.
What elements does CuSn contain?
CuSn contains Cu and Sn (2 elements).
Where does the data for CuSn come from?
CuSn data is cross-referenced from jarvis, oqmd, materials_project, cod, mpaloe.
Comparison

How It Compares

As a binary intermetallic, CuSn serves as a fundamental reference point for understanding copper-tin interactions. It occupies a distinct space in alloy research where its near-hull stability highlights the delicate balance of phases possible within the copper-tin system.

Data sources & attribution
  • jarvis — Data from JARVIS (jarvis.nist.gov), NIST. Cite: Choudhary et al., npj Comp. Mater. 6, 173 (2020). (LicenseRef-US-Gov-PD)
  • oqmd — Data from the OQMD (oqmd.org). Cite: Saal et al., JOM 65, 1501 (2013); Kirklin et al., npj Comp. Mater. 1, 15010 (2015). (CC-BY-4.0)
  • materials_project — Data from the Materials Project (materialsproject.org). Cite: Jain et al., APL Materials 1, 011002 (2013). (CC-BY-4.0)
  • cod — Data from the Crystallography Open Database (crystallography.net/cod/). Cite: Grazulis et al., J. Appl. Cryst. 42, 726 (2009). (CC0-1.0)
  • mpaloe — Data from MP-ALOE. Cite: Kuner et al., npj Comput. Mater. (2025), doi:10.1038/s41524-025-01834-9.

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