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Industry Focus

Semiconductor packaging

Shortlist dielectric, underfill, TIM, and substrate materials for advanced packaging nodes by unifying thermal, electrical, and reliability signals with qualification context.

Best-fit teams

Package design, substrate engineering, advanced packaging R&D, reliability qualification, and outsourced assembly and test teams

Typical questions
Which low-k dielectric candidates meet our electrical targets without failing thermal cycling reliability?
Where is the CTE mismatch risk in our current package stack, and which materials could resolve it?
Which critical packaging materials have single-source supply risk?
Where teams get stuck

The decision gap this page is built for

Advanced packaging nodes demand materials that simultaneously meet thermal, electrical, mechanical, and manufacturability constraints — but these signals live in separate vendor datasheets, simulation outputs, and reliability test reports.

How Lattice Graph helps

Capabilities aligned to this workflow

Compare dielectric and underfill candidates across thermal conductivity, CTE match, and dielectric constant targets
Overlay your reliability test data on simulation predictions to flag high-risk combinations once LIMS import ships (planned)
Surface qualification burden and second-source availability before committing to reliability programs
Decision flow

A typical way teams use the platform here.

01

Screen the package material stack

Evaluate dielectric, underfill, TIM, and substrate options against node-specific thermal, electrical, and mechanical requirements.

02

Cross-reference reliability signals

Planned, once LIMS import ships: connect simulation predictions with your accelerated test results to flag material-process combinations with possible reliability risk.

03

Prepare for qualification

Document evidence quality, second-source options, and expected qualification timeline for shortlisted materials.

Signals in scope

What teams usually need in one screen.

Dielectric constant and loss tangent
Thermal conductivity and CTE match
Reliability under thermal cycling and humidity
Second-source availability and supply risk
Expected outcome

Advance packaging material candidates with clearer evidence across all constraint dimensions — reducing qualification surprises and late-stage material changes.

Related markets

Adjacent segments with similar fit.

Power semiconductors
Electronic components and passive devices
Thermal interface materials
Consumer electronics hardware
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