TaN

Tantalum nitride · Tantalum(III) nitride

Tantalum nitride is a hard, refractory ceramic material known for its high chemical stability and mechanical durability. It is frequently utilized in microelectronics and thin-film technology due to its excellent barrier properties against metal diffusion.

Crystal structure of TaN (hexagonal, P-62m (No. 189))
Ground-state structure · Materials Project
Overview

Key Properties

Cross-validated computational properties for Tantalum nitride, aggregated across 4 databases.

Band Gap

0.04 eV
Range across DFT structures

Energy Above Hull

0.000 eV/atom
Best (lowest) across sources

Stability

On hull (stable)
2 DFT sources

Structures

504
4 databases, 46 space groups
Crystallography

Reported Structures

Lowest-energy structures reported for TaN, ranked by energy above hull.

Space GroupCrystal SystemBand Gap (eV)E above hull (eV/atom)E/atom (eV)Density (g/cm³)
P-62m (No. 189)hexagonal0.000.0000-30.21914.18
P-6m2 (No. 187)hexagonal0.000.0206-30.19814.96
P63/mmc (No. 194)hexagonal0.000.2425-29.97714.80
Fm-3m (No. 225)cubic0.000.3289-29.89014.97
P6/mmm (No. 191)hexagonal0.000.4516-29.76713.81
P1 (No. 1)triclinic0.030.4633-29.75612.93
F-43m (No. 216)cubic0.000.4917-29.72711.99
P1 (No. 1)triclinic0.040.5015-29.71812.67
P1 (No. 1)triclinic0.000.5044-29.71511.98
P1 (No. 1)triclinic0.000.5161-29.70312.53
P1 (No. 1)triclinic0.040.5188-29.70012.60
Pm-3m (No. 221)cubic0.000.8163-29.40315.49
Uses

Applications

Where Tantalum nitride is used.

Diffusion barriers in semiconductor manufacturingThin-film resistorsProtective coatings for cutting toolsMicroelectronic interconnects
Reference

Frequently Asked Questions

Common questions about Tantalum nitride, answered from cross-validated data.

What is TaN?

Tantalum nitride is a hard, refractory ceramic material known for its high chemical stability and mechanical durability. It is frequently utilized in microelectronics and thin-film technology due to its excellent barrier properties against metal diffusion.

More questions
What is TaN used for?
Tantalum nitride (TaN) is used in diffusion barriers in semiconductor manufacturing, thin-film resistors, protective coatings for cutting tools, and microelectronic interconnects.
What is the band gap of TaN?
Tantalum nitride (TaN) has a DFT-computed band gap of 0.04 eV across 504 reported structures.
Is TaN a metal, semiconductor, or insulator?
With a near-zero band gap it behaves as a (semi)metal.
Is TaN thermodynamically stable?
Yes — Tantalum nitride (TaN) sits on the convex hull (energy above hull 0 eV/atom), i.e. on hull (stable).
What is the crystal structure of TaN?
The lowest-energy reported polymorph of Tantalum nitride (TaN) is hexagonal symmetry, space group P-62m (No. 189).
What is the density of TaN?
The computed density of the ground-state structure of Tantalum nitride (TaN) is 14.18 g/cm³.
How many polymorphs of TaN are known?
504 structures of TaN are reported across 4 databases, spanning 46 distinct space groups.
What elements does TaN contain?
Tantalum nitride (TaN) contains N and Ta (2 elements).
Where does the data for TaN come from?
TaN data is cross-referenced from materials_project, jarvis, mpaloe.
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Related Compounds

Other Ultra-High-Temperature Ceramics in the database.

Data sources & attribution
  • materials_project — Data from the Materials Project. Cite: Jain et al., APL Materials 1, 011002 (2013).
  • jarvis — Data from JARVIS (NIST). Cite: Choudhary et al., npj Comp. Mater. 6, 173 (2020).
  • mpaloe — Data from mpaloe.

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