Cu3Sn
Bronze · epsilon-phase copper-tin, Cu3Sn intermetallic
This intermetallic compound is a stable phase formed within copper-tin alloy systems. It is frequently encountered in microelectronics as a reaction product during the formation of solder joints between copper components and tin-based solders.
CuSn
Overview
Key Properties
Cross-validated computational properties for Bronze, aggregated across 5 databases.
Band GapEnergy needed to move an electron from the valence band to the conduction band. Lower or zero values tend to behave more metallic; larger gaps are more insulating or semiconducting.
Metallic / not reported
Energy Above HullThermodynamic distance from the most stable set of competing phases. 0 eV/atom is on the convex hull; small positive values may still be experimentally accessible.
0.027 eV/atom
Best (lowest) across sources
StabilityA plain-language summary of the best reported energy-above-hull result. It reflects whether the lowest-energy structure is on, near, or far from the stability hull.
Metastable
3 DFT sources
StructuresCount of reported calculated crystal structures for this formula, including alternate polymorphs, source databases, and observed space groups.
26
5 databases, 10 space groups
Validation
Cross-Source DFT Agreement
How well independent DFT databases agree on the thermodynamics of Cu3Sn. Tight agreement means computed properties can be trusted without re-running calculations.
Agreement ScoreA normalized confidence score summarizing how closely independent DFT databases agree. Higher scores mean tighter cross-source agreement.
1.00 / 1.00
Trust tier: high
Hull SpreadDifference between the highest and lowest energy-above-hull values reported by comparable sources. Smaller spread means less thermodynamic disagreement.
0.000 eV
EAH spread across sources
Sources ComparedNumber and names of computational sources with comparable entries for this formula.
3
jarvis, materials_project, nomad
Space Group ConsensusWhether independent sources predict the same crystal symmetry for the lowest-energy structure.
All match
Crystallography
Reported Structures
Lowest-energy structures reported for Cu3Sn, ranked by energy above hull.
| Space GroupSymmetry classification of the crystal arrangement. The number is the international space-group index. | Crystal SystemBroad lattice family, such as cubic, tetragonal, monoclinic, or triclinic, derived from unit-cell symmetry. | Band Gap (eV)Electronic gap calculated for this specific reported structure, measured in electronvolts. | E above hull (eV/atom)Thermodynamic distance from the convex hull for this structure, normalized per atom. Lower is generally more stable. | E/atom (eV)Computed total energy normalized per atom. Use energy above hull, not this value alone, when comparing stability. | Density (g/cm³)Mass per relaxed crystal volume, reported in grams per cubic centimeter. |
|---|---|---|---|---|---|
| Cmcm (No. 63) | orthorhombic | 0.00 | 0.0269 | -14.295 | 8.80 |
| Pmmn (No. 59) | orthorhombic | 0.00 | 0.0335 | -14.288 | 9.18 |
| P63/mmc (No. 194) | hexagonal | 0.00 | 0.0360 | -14.286 | 9.16 |
| Fm-3m (No. 225) | cubic | 0.00 | 0.0736 | -14.248 | 8.76 |
| P-1 (No. 2) | Triclinic | — | — | — | 6.62 |
| Pmmn (No. 59) | — | — | — | — | — |
| P63/mmc (No. 194) | Hexagonal | — | — | — | 9.16 |
| P63/mmc (No. 194) | Hexagonal | — | — | — | 9.30 |
| P63/mmc (No. 194) | Hexagonal | — | — | — | 8.88 |
| P-6m2 (No. 187) | Hexagonal | — | — | — | 7.33 |
| Pmmn (No. 59) | Orthorhombic | — | — | — | 9.19 |
| Pmmn (No. 59) | Orthorhombic | — | — | — | 8.90 |
Uses
Applications
Where Bronze is used.
Solder joint interfacesMicroelectronic packagingMetallurgical research
Reference
Frequently Asked Questions
Common questions about Bronze, answered from cross-validated data.
What is Cu3Sn?
This intermetallic compound is a stable phase formed within copper-tin alloy systems. It is frequently encountered in microelectronics as a reaction product during the formation of solder joints between copper components and tin-based solders.
More questions
What is Cu3Sn used for?
Bronze (Cu3Sn) is used in solder joint interfaces, microelectronic packaging, and metallurgical research.
What is the band gap of Cu3Sn?
Bronze (Cu3Sn) is computed to be metallic (no band gap) in the reported DFT structures.
Is Cu3Sn a metal, semiconductor, or insulator?
Computed band structures report no gap, so it is metallic.
Is Cu3Sn thermodynamically stable?
Bronze (Cu3Sn) has a lowest energy above hull of 0.027 eV/atom (metastable).
What is the crystal structure of Cu3Sn?
The lowest-energy reported polymorph of Bronze (Cu3Sn) is orthorhombic symmetry, space group Cmcm (No. 63).
What is the density of Cu3Sn?
The computed density of the ground-state structure of Bronze (Cu3Sn) is 8.80 g/cm³.
How many polymorphs of Cu3Sn are known?
26 structures of Cu3Sn are reported across 5 databases, spanning 10 distinct space groups.
What elements does Cu3Sn contain?
Bronze (Cu3Sn) contains Cu and Sn (2 elements).
Where does the data for Cu3Sn come from?
Cu3Sn data is cross-referenced from materials_project, mpaloe, jarvis, nomad.
Data sources & attribution
- materials_project — Data from the Materials Project. Cite: Jain et al., APL Materials 1, 011002 (2013).
- mpaloe — Data from mpaloe.
- jarvis — Data from JARVIS (NIST). Cite: Choudhary et al., npj Comp. Mater. 6, 173 (2020).
- nomad — Data from NOMAD. Cite: Draxl & Scheffler, J. Phys. Mater. 2, 036001 (2019).
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