Al2Cu
Copper dialuminide · theta phase
Copper dialuminide is an intermetallic compound that frequently forms as a precipitate within aluminum-copper alloys. It plays a critical role in the strengthening mechanisms of these alloys by hindering the movement of dislocations within the crystalline structure.
Key Properties
Cross-validated computational properties for Copper dialuminide, aggregated across 4 databases.
Band GapEnergy needed to move an electron from the valence band to the conduction band. Lower or zero values tend to behave more metallic; larger gaps are more insulating or semiconducting.
Energy Above HullThermodynamic distance from the most stable set of competing phases. 0 eV/atom is on the convex hull; small positive values may still be experimentally accessible.
StabilityA plain-language summary of the best reported energy-above-hull result. It reflects whether the lowest-energy structure is on, near, or far from the stability hull.
StructuresCount of reported calculated crystal structures for this formula, including alternate polymorphs, source databases, and observed space groups.
Reported Structures
Lowest-energy structures reported for Al2Cu, ranked by energy above hull.
| Space GroupSymmetry classification of the crystal arrangement. The number is the international space-group index. | Crystal SystemBroad lattice family, such as cubic, tetragonal, monoclinic, or triclinic, derived from unit-cell symmetry. | Band Gap (eV)Electronic gap calculated for this specific reported structure, measured in electronvolts. | E above hull (eV/atom)Thermodynamic distance from the convex hull for this structure, normalized per atom. Lower is generally more stable. | E/atom (eV)Computed total energy normalized per atom. Use energy above hull, not this value alone, when comparing stability. | Density (g/cm³)Mass per relaxed crystal volume, reported in grams per cubic centimeter. |
|---|---|---|---|---|---|
| Fm-3m (No. 225) | cubic | 0.00 | 0.0000 | -8.316 | 4.15 |
| I4/mcm (No. 140) | tetragonal | 0.00 | 0.0476 | -8.269 | 4.53 |
| P4/mmm (No. 123) | tetragonal | 0.00 | 0.1545 | -8.162 | 4.00 |
| P21/m (No. 11) | Monoclinic | — | — | — | 4.71 |
| Pmmn (No. 59) | Orthorhombic | — | — | — | 3.79 |
| Pmmn (No. 59) | Orthorhombic | — | — | — | 4.07 |
| P-1 (No. 2) | Triclinic | — | — | — | 5.21 |
| P-1 (No. 2) | Triclinic | — | — | — | 4.16 |
| P-1 (No. 2) | Triclinic | — | — | — | 4.50 |
| C2/m (No. 12) | Monoclinic | — | — | — | 3.44 |
| C2/m (No. 12) | Monoclinic | — | — | — | 3.37 |
| P-1 (No. 2) | Triclinic | — | — | — | 3.22 |
Applications
Where Copper dialuminide is used.
Frequently Asked Questions
Common questions about Copper dialuminide, answered from cross-validated data.
What is Al2Cu?
Copper dialuminide is an intermetallic compound that frequently forms as a precipitate within aluminum-copper alloys. It plays a critical role in the strengthening mechanisms of these alloys by hindering the movement of dislocations within the crystalline structure.
What is Al2Cu used for?
What is the band gap of Al2Cu?
Is Al2Cu a metal, semiconductor, or insulator?
Is Al2Cu thermodynamically stable?
What is the crystal structure of Al2Cu?
What is the density of Al2Cu?
How many polymorphs of Al2Cu are known?
What elements does Al2Cu contain?
Where does the data for Al2Cu come from?
Data sources & attribution
- materials_project — Data from the Materials Project. Cite: Jain et al., APL Materials 1, 011002 (2013).
- mpaloe — Data from mpaloe.
Analyze Al2Cu in the Lattice Graph platform
Polymorph comparison, confidence scoring, supply-chain risk, and patent monitoring — across 53 integrated data sources.
Explore the Platform →